The Iba 2015 in Munich was a very successful event. We presented our highly successful WAFER BAKING MACHINE of the type BAC which can be equipped with baking plates up to the size of 730 x 350 mm. This type of baking machine has been considered for years to be leading the field of the processing industry which, among other things, is attributable to its advantageous features that are in particular: The „green burner” system for lowest CO emissions and lowest gas consumption The worldwide-proven baking plate locking system with vertical locking hook The especially simple and precise baking plate adjustment
Furthermore, we presented our SNACK EXTRUDER of the type SE 70 with the capacity to produce 100 – 300 kg of unflavoured snacks per hour which can be processed further on up to 500 kg of final product - sweet or savoury snacks - per hour.
Furthermore, we have informed about many interesting details of HEBENSTREIT- technologies listed below: Wafer baking machine types WAQ/BAC Wafer sheet cooler EPH Wafer sheet conditioning tunnel CK Film/Contact spreading machine WZ/WZK Check weighing system KW Pressing station WEA Cooling tower/Spiral cooler KT/KSP Wafer sandwich cutting machine WD Wafer discharge device WEP Wafer sandwich storage system ERM Wafer production plants type COMPACT Baking plate cleaning system using laser technology This technology allows cleaning of even our largest wafer baking machines in one single work shift, only. High-performance technology using baking plates of the size 1000 x 350 mm. Wafer batter preparation plant TMX for the fully automatic production of standard or sugar-containing wafer batters. We offer solutions for the conveying of the raw materials from their delivery to the factory up to their feeding and dosing into the mixer. Such equipment comprises silo technology, FIBC emptying stations, conveying systems, intermediate containers etc. All recipe ingredients are weighed in the mixer and processed until achieving a homogeneously mixed wafer batter.
The interpack Fair 2014 in Duesseldorf again was a very successful event for us during which we had the opportunity to demonstrate our customers from all over the world our strong market position as supplier of high-quality wafer production lines.
We would like to thank you very much for having visited our stand and for your interest in our machines with which you have contributed to make our participation such a successful event. Many thanks for your appreciated support.
Baking plate cleaning system with laser technology This technology cleans even our largest wafer baking machines within one shift, only.
Super-size wafer sheet production technology in plate size of 1000 x 350 mm
Snack extruder SE 70 Our proven technology has been revived and optimized to achieve highest performance.
Wafer batter mixing plant TMX for the fully automatic production of standard or sugar wafer batter. We offer solutions for taking over the ingredients when they enter the factory until they are weighed and fed into the mixers. This includes silos, bag dump stations, conveying systems, holding tanks, etc. The mixer weighs all ingredients and prepares homogeneous and consistent batter batches.
Raw material feeding and dosing systems for batter and cream preparation plants for all dry and liquid ingredients
Latest technology for the fully automatic production of flat and hollow wafers:
Wafer baking machine BACB with plate size of 700 x 350 mm Including: - “Green Burner” system for lowest CO emissions and gas consumption - Worldwide-proven baking plate locking system with vertical hook - Simple and “never-seize” plate adjustment
Wafer sheet cooler EPH
Wafer sheet conditioning tunnel CK
Wafer sheet distribution system ERV
Wafer sandwich film spreading machine WZ
Wafer sandwich check weighing system KW
Wafer sandwich pressing station WEA
Wafer sandwich cooling tower KT
Wafer sandwich cutting machine WD
Wafer discharge device WEP
Wafer sandwich storage system ERM executed with vacuum “pick and place” system. This unit can be added to any existing wafer sandwich conveyor.
Wafer baking machine WAQ with plate size of 500 x 350 mm