The planning of a wafer production line complies with the products to be manufactured and the capacity required. Plants of maximum versatility offer the flexibility to be able to react on steadily changing market conditions.
In due consideration of the space conditions available at the installation site our project engineers elaborate mostly customized solutions.


Manufacturing Process for Flat Wafers:
The wafer batter is produced in batches and deposited onto the baking plates at the batter depositing station of the automatic wafer baking machine. According to the preselected baking time and baking temperature, the wafer sheets are baked, automatically discharged and transferred onto the further processing line. While being transported through the wafer sheet cooler, the wafer sheets cool down before they are fed onto the fully automatic wafer spreading machine.
In case of chocolate-coated products an additional conditioning of the wafer sheets is recommended. The spreading machine applies the cream filling by either the film or the contact method, before the wafer sheets are stacked according to the preselected number, the cover sheet is placed on top and the wafer sandwiches are calibrated to achieve the required thickness. For the preparation of the cream fillings, special cream production plants with different degree of automation are available.
In continuation, the wafer sandwiches pass through a wafer sandwich cooler so that the cream sets sufficiently for cutting and packing.
Cutting of the sandwiches into the desired size is carried out by means of a fully automatic cutting machine. Depending on the product required, the cut wafers are conveyed directly onto a packaging machine or transferred to a downstream chocolate coating plant.


Manufacturing Process for Hollow Wafers:
Hollow wafers are made up of two wafer halves that are filled and joined. The baking plates of the automatic wafer baking machine are executed in accordance with the shape of product to be manufactured. In contrast to the manufacturing process for flat wafers, however, the hollow wafer sheets to be covered with cream receive the application by the film method after which two cream-filled wafer sheets each are joined at a time. As an option, for example, a hazelnut kernel can be inserted in every second cavity. Depending on the shape of the product, the cutting of the wafer sandwiches is carried out by means of a cutting machine in case of rectangular or square surfaces or by means of a punching machine which tools are either round or executed in accordance with the product shape.