Fully automatic feeding equipment is available for wafers that are not chocolate-coated or moulded in chocolate. These transport the wafers tot he following packaging machines.
Wafer Discharge Device WEP Cut wafer rows are fed to the packaging machines in single or double rows to the left or right or to the left and right.
Wafer Distribution Device EG For continuous distribution of cut wafer bars and the feeding of a downstream coating plant.
Magazine Cutter EGS Pre-cut wafer sandwich bars are loaded manually into the magazines of the magazine cutter, cut automatically, distributed and transported directly to a downstream chocolate coating plant.
Magazine Cutter EGS-S For the cutting and distribution of unfilled wafer squares.
Cutting and Inserting Device Production of moulded wafer bars: The cut wafer fingers are picked up by means of a special distribution head and inserted in the moulds of a chocolate moulding plant.
