As well as suitable cutting and feeding facilities for downstream plant sections, we also offer a range of special product-specific, customized machines.
Wafer Cutting Machine WD Fully automatic cutting machine for cutting cream, caramel or jam-filled wafers, suitable for both flat and hollow wafers.
Wafer Cutting Machine WD Depending on the subsequent further processing, the wafer sandwiches are cut as single sandwiches.
Wafer Cutting Machine – Twin Version For optimum utilisation of a downstream coating plant.
Wafer cutting machine with automatic removal station and downstream wafer discharge device
Cutting Group with upstream wafer sandwich storage unit If production is interrupted, the wafer sandwiches are automatically taken out of the production line and are later automatically transferred back to it.